Ultra-high thermal conductivity nano AlN composite silica gel has good thermal conductivity, good electrical insulation, wide electrical insulation temperature (operating temperature -60 ° C - 200 ° C), low consistency and good construction performance. The products have reached or exceeded the imported products, because they can replace the similar imported products and are widely used in the heat transfer medium of electronic devices to improve work efficiency. Such as CPU and heat sink caulking, high-power triode, thyristor components, diodes, heat transfer medium at the slits in contact with the substrate. The nano-thermal paste is used to fill the gap between the IC or the triode and the heat sink, increasing the contact area between them to achieve better heat dissipation.

2, the application of thermal plastics

nano aluminum nitride powder can greatly improve the thermal conductivity of plastics. By adding the experimental product to the plastic in a ratio of 5-10%, the thermal conductivity of the plastic can be increased from 0.3 to 5. The thermal conductivity has increased by more than 16 times. Compared with the current thermal conductive fillers on the market (alumina or magnesium oxide, etc.), the addition amount is low, the mechanical properties of the product are improved, and the heat conduction effect is more obvious. At present, relevant application manufacturers have purchased nanometer aluminum nitride powder on a large scale, and new nano-thermal conductive plastics will be put on the market.

3, the application of high thermal conductivity silicone rubber

The procurement and silicon matching performance is good, easy to disperse in the rubber, without affecting the mechanical properties of the rubber (experimental proof of the mechanical properties of the rubber has improved) can greatly enhance silicon The thermal conductivity of rubber does not increase the viscosity very quickly in the process of addition, such as oxides, and the addition amount is small (the thermal conductivity is generally increased by 50%-70% according to the heat conduction requirement), and is widely used in Military, aviation and information engineering.

4, other application areas

Nano aluminum nitride used in the melting of non-ferrous metals and semiconductor materials gallium arsenide, evaporation boat, thermocouple protection tube, high temperature insulation, microwave dielectric materials, high temperature and corrosion resistant structural ceramics and Transparent aluminum nitride microwave ceramic products, as well as current applications and PI resin, thermal insulation mica tape, thermal grease, insulating paint and heat transfer oil.