CAS 7440-05-3 Pd nanopowder Ultrafine Palladium as catalyst
Size:20-30nm Purity:99.95% CAS No:7440-05-3 ENINEC No.:231-115-6 Appearance:black Powder Shape:spherical
13929258449
Size:20-30nm Purity:99.95% CAS No:7440-05-3 ENINEC No.:231-115-6 Appearance:black Powder Shape:spherical
We can supply different size products of niobium silicide powder according to client's requirements. Size:1-3um; Purity:99.5%;Shape:granular CAS No:12034-80-9;ENINEC No.:234-812-3
Ni2Si particle,99.5% purity,granular shape,is used for Microelectronic integrated circuit, nickel silicide film,etc. Size:1-10um; CAS No:12059-14-2;ENINEC No.:235-033-1
Buy Beta Sic Whisker to Strengthen Resin Diamond Grinding Wheel, Diameter:0.1-1.0um ; Length:10-50um ; Purity:99%, Appearance: green Powder, please click it to check the specification
Brand:
SAT NANOItem NO.:
CP1406P-NWPayment:
TT, Paypal, WUProduct Origin:
ChinaColor:
green PowderShipping Port:
Shenzhen, ShanghaiLead Time:
1-5daysMin Order:
100gSpecification of SiC whisker:
CAS No:409-21-2 ; ENINEC No.:206-991-8 ; Shape:Needle
Diameter:0.1-1.0um ; Length:10-50um
SAT NANO is one of the best supplier of Sic whisker in China, good quality, low price with fast delivery, if you have any enquiry, please feel free to contact us.
Application of SiC whisker:
Silicon carbide Beta SiC whiskers can significantly increase the service life of resin diamond grinding wheels.
Diamond grinding wheels use diamond abrasives as raw materials, and metal powder, resin powder, ceramics and electroplated metal as binders. The circular integral grinding tool with a through hole in the center is called a diamond grinding wheel (alloy grinding wheel).
Generally speaking, resin bond diamond grinding wheels have a low life and cannot meet the requirements of advanced CNC machine tools. The wear of the grinding wheel can easily cause the fluctuation of the workpiece size and the excessive tolerance. The short service life is mainly due to the poor wear resistance of the resin binder itself or the low control of the diamond, which leads to premature fall off. Therefore, how to improve the resin bond Wear resistance, improving the resin's control of diamond, has become the key to increasing the service life of resin bond diamond grinding wheels.
Adding silicon carbide βsic whiskers can greatly improve the strength, hardness, heat resistance and polishing performance of the adhesive and grinding wheel. Silicon carbide whiskers have unique mechanical and physical and chemical properties, such as high hardness, high strength (toughness), and excellent wear resistance. Therefore, they are widely used in metals, ceramics, plastics and composite materials to enhance the strength of composite materials. Prevent shrinkage and deformation. The shape of silicon carbide whiskers is needle-like, especially its Webster hardness is close to diamond, with good toughness and good wear resistance. Moreover, compared with whiskers of a certain size, whiskers with a certain length even have the same diameter and particle size, but also have a larger bonding area and bonding strength with the binder, thereby greatly improving the use of the grinding wheel life.
The β-micron silicon carbide whiskers produced by Hongwu Nano have the characteristics of high purity and good morphology, and their toughening effect and application range are unmatched by other materials.
β silicon carbide whisker is a single needle crystal, which is an atomic crystal with low density, high melting point, high strength, high modulus, low thermal expansion, wear resistance, corrosion resistance, high temperature resistance, and oxidation resistance And other excellent properties, it is mainly used for the reinforcement and toughening of metal matrix, ceramic matrix, and resin matrix composite materials, which significantly improves the performance of composite materials. The main physical performance indicators are as follows: