As one of the many thermal conductive materials, boron nitride is a unique one. Among the high thermal conductivity categories, it has high insulation, and among the high thermal conductivity and high insulation types, it is the cheapest.

In the semiconductor industry's heat dissipation system, interface materials are the biggest bottleneck and the component with the lowest thermal conductivity. No matter what heat dissipation system you use, the bottleneck of interface thermal resistance will make the efforts of heat dissipation system engineers go to waste. The most promising alternative to alumina is boron nitride. The developed boron nitride thermal interface material has a longitudinal thermal conductivity of over 20 watts and a thermal resistance of 0.85k/cm2/w @ 1mm, surpassing all insulation thermal conductivity products, and achieving high flexibility and resilience. The production process is solvent-free. In laboratory simulation tests, compared with domestic 12 watt thermal pads, the heat source temperature drops by 23.5 ℃. In the application verification of optical modules, crush the carbon fiber thermal pad of foreign brands. Various indications suggest that replacing aluminum oxide with boron nitride is actually feasible. Of course, technological success does not necessarily guarantee market success. Currently, more and more material researchers are investing in the research of boron nitride, and there will always be someone who breaks through market barriers and brings new technologies and products to the market.

The boron nitride industry will be a promising market, and domestic manufacturers should accelerate product research and development towards high purity, monocrystalline, large particle size, and low cost, in conjunction with the needs of thermal interface materials, to jointly promote industrial upgrading.

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