CAS 7440-05-3 Pd nanopowder Ultrafine Palladium as catalyst
Size:20-30nm Purity:99.95% CAS No:7440-05-3 ENINEC No.:231-115-6 Appearance:black Powder Shape:spherical
13929258449
Size:20-30nm Purity:99.95% CAS No:7440-05-3 ENINEC No.:231-115-6 Appearance:black Powder Shape:spherical
We can supply different size products of niobium silicide powder according to client's requirements. Size:1-3um; Purity:99.5%;Shape:granular CAS No:12034-80-9;ENINEC No.:234-812-3
Ni2Si particle,99.5% purity,granular shape,is used for Microelectronic integrated circuit, nickel silicide film,etc. Size:1-10um; CAS No:12059-14-2;ENINEC No.:235-033-1
Buy hot sale high thermal conductivity spherical alumina micron particle, size 1-3um, 5um, 10um, 45um, 70um,
Purity 99.6%, good quality, low price and fast delivery, please click it to check the specification.
Brand:
SAT NANOItem NO.:
OP12B08C-1UPayment:
TT, Paypal, WUProduct Origin:
ChinaColor:
White PowderShipping Port:
Shenzhen, ShanghaiLead Time:
1-5daysMin Order:
1kgSpecification of thermal conductivity alumina:
CAS No:1344-28-1 ENINEC No.:215-691-6
Appearance:white Powder
Particle size:1-3um, 5um, 10um, 45um, 70um
Purity:>=99.6%
Type:Spherical
Note: We can supply different size products of high purity alumina according to client's requirements.
Product Performance
The series of spherical alumina produced by the high-temperature melt-spraying method has the characteristics of high sphericity and high content of α-phase alumina. It shows superior performance when used as a filler for rubber, plastics and ceramic raw materials.
Main features/Characteristic
1. High filling
The particles have a high sphericity and a wide particle size distribution. They can be filled with silicone rubber and plastic at high density, and a mixture with low viscosity and good fluidity can be obtained.
2. High thermal conductivity
Because of its high-density filling, it can obtain a mixture with high thermal conductivity and good heat dissipation compared with crystalline silicon fine powder.
3. Low abrasion
Because of its spherical appearance, the abrasion of mixers, molding machines, molds and other equipment is greatly reduced, which can extend the service life of the equipment.
Application of thermal conductivity alumina:
(1) Heat sink, filler for heat sink substrate (MC substrate), thermal grease, phase change sheet
(2) Filler for semiconductor encapsulation resin
(3) Silicone heat dissipation adhesive and filler for mixture
(4) Ceramic filter
Storage conditions:
thermal conductivity alumina should be sealed and stored in a dry and cool environment. It should not be exposed to the air for a long time, to prevent agglomeration due to moisture, affecting the dispersion performance and use effect, and should avoid heavy pressure, do not contact with oxidant, and transport according to ordinary goods.