Filling material used spherical silicon dioxide silica sio2 powder 500nm

Specification of spherical silica powder

CAS No:14808-60-7 ENINEC No.:231-545-4

Appearance:white Powder

Shape:spherical

Purity:99.9%

Size: 300nm, 500nm, 1-3um, 5um, 10um, 20um

What are the advantages of spherical silica: First of all, the surface of the ball has good fluidity, and it is evenly mixed with the resin to form a film. The amount of resin added is small, and the fluidity is the best. The filling amount of powder can reach the highest, and the weight ratio can reach 90.5%. Therefore, spheroidization means an increase in the filling rate of silicon micropowder. The higher the filling rate of silicon micropowder, the smaller the thermal expansion coefficient and the lower the thermal conductivity, and the closer to the thermal expansion coefficient of single crystal silicon. The performance of the device is also better. Secondly, the spheroidized plastic molding compound has the least stress concentration and the highest strength. 

When the stress concentration of the angular powder molding compound is 1, the stress of the spherical powder is only 0.6. Therefore, when the spherical powder molding compound encapsulates the integrated circuit chip, the yield rate High, and it is not easy to produce mechanical damage during transportation, installation and use. Third, the spherical powder has a small friction coefficient and less wear on the mold, which makes the mold have a long service life. Compared with the angular powder, the service life of the mold can be doubled. The packaging mold of the plastic compound is expensive, and some Imports are also needed, which reduces costs for packaging plants and improves economic efficiency.