Electronics material nano AlN powders

Specification of Ultrafine Aluminum Nitride:

CAS No:24304-00-5

ENINEC No.:246-140-8
Appearance:grey white Powder

Shape:Hexagonal&irregula crystal

Note: We can supply different size products of AlN powder according to client's requirements.

Application of Ultrafine Aluminum Nitride:

Electronic materials: The thermal conductivity of aluminum nitride is about 10 times that of alumina, which can effectively dissipate heat. It is a metal polymer matrix composite material made of integrated circuit substrates, electronic equipment, optical equipment, heat sinks, and temperature crucibles. It is a material loaded in high-temperature sealants and electronic seals to improve cooling performance and strength characteristics and has an excellent prospect.

For example, the application in thermally conductive silica and conductive epoxy resin: the use of nano aluminum nitride to prepare ultra-high thermally conductive silica, which has good thermal conductivity, good insulation properties, wide electrical insulation and temperature (temperature 80-250 °C ), low consistency and good construction performance, widely used as the heat transfer medium of electronic equipment to improve work efficiency. Practical applications in many fields, such as the application of nano thermal paste for CPUs and heat sinks, power transistors, thyristors, diodes, contact with the substrate slits on the heat transfer medium, increase the contact area between them to achieve better The cooling effect.