High Thermal Conductivity Ceramic Material AlN Aluminum Nitride powder

Specification of AlN Aluminum Nitride:

CAS No:24304-00-5

ENINEC No.:246-140-8
Appearance:grey white Powder

Shape:Hexagonal&irregula crystal

Note: We can supply different size products of AlN powder according to client's requirements.

Aluminum nitride (AlN) is the only industrial ceramic material with an interesting combination of extremely high thermal conductivity and excellent electrical insulation properties. Multifunctional aluminum nitride powder is widely used due to its good properties.

1. Nano aluminum nitride has the characteristics of high purity, small particle size, uniform distribution, large specific surface area, high surface activity, low bulk density, and good injection molding performance;

2. When used in equipment manufacturing, it can reduce the sintering temperature, improve the dimensional stability, and improve the hardness and elastic modulus of the equipment. The dielectric constant is high, the dielectric loss is small, the thermal conductivity is good, the oxidation resistance and the thermal expansion coefficient are low (similar silicon).

3. For composite materials, the matching with semiconductor silicon is also very good, and the interface compatibility is also good. It can improve the mechanical and thermal conductivity of composite materials.

Application of AlN Aluminum Nitride:

1. The thermal conductivity of silicone and epoxy resin: the ultra-high thermal conductivity of nano-AlN composite silicone, with good thermal conductivity, electrical insulation, and wide electrical insulation working temperature (working temperature -60℃-200 ℃), low consistency and good construction performance. The product has reached or exceeded imported products, because it can replace the same imported products, and is widely used as a heat transfer medium in electronic equipment to improve work efficiency. Such as the caulking of CPU and heat sink, high-power transistors, thyristor components, and diodes are in contact with the substrate cut in the heat transfer medium. Nano thermal paste fills the gap between the IC or transistor and the heat sink, thereby increasing the contact area between them to achieve a better cooling effect.

2. Application of thermoplastics: Nano aluminum nitride powder can significantly improve the thermal conductivity of plastics. Experiments have shown that adding 5%-10% to the plastic can increase the thermal conductivity of the plastic from 0.3 to 5. The thermal conductivity has been increased by 16 times. Compared with the current thermal fillers on the market (aluminum oxide or magnesium oxide, etc.), the low addition amount of nano-AlN can improve the mechanical properties of the product, and the thermal conductivity is more significantly improved. At present, relevant application manufacturers have purchased nano aluminum nitride powder on a large scale, and new nano thermal plastics will be put on the market.

3. Application of high thermal conductivity silicone rubber: good matching performance with silicon, easy to disperse in rubber. Not only does it not affect the mechanical properties of rubber (experiments have shown that the mechanical properties of rubber are also improved), but also can greatly improve the thermal conductivity of silicone rubber. It has been widely used in military fields, aviation and information engineering.

4. Other applications: nano aluminum nitride, gallium arsenide crucible for smelting non-ferrous metals and semiconductor materials, evaporation boats, thermocouple protection tubes, high temperature insulation, microwave dielectric materials, high temperature and corrosion resistant structural ceramics and transparent Aluminum nitride microwave ceramic products are currently used with PI resin, thermal insulation mica tape, thermal grease, insulating paint and thermal oil.