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CAS 7440-05-3 Pd nanopowder Ultrafine Palladium as catalyst

Size:20-30nm Purity:99.95% CAS No:7440-05-3 ENINEC No.:231-115-6 Appearance:black Powder Shape:spherical
CAS 12034-80-9 niobium silicide powder NbSi2 powder 1um

We can supply different size products of niobium silicide powder according to client's requirements. Size:1-3um; Purity:99.5%;Shape:granular CAS No:12034-80-9;ENINEC No.:234-812-3
CAS 12059-14-2 nickel silicide powder Ni2Si powder 10um

Ni2Si particle,99.5% purity,granular shape,is used for Microelectronic integrated circuit, nickel silicide film,etc. Size:1-10um; CAS No:12059-14-2;ENINEC No.:235-033-1

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high purity 99.95 Sn powder tin powder for Semiconductor packaging

buy high purity 99.95 Sn powder tin powder for Semiconductor packaging, Size:25-63um, 25-45um, 20-38um,15-25um, Purity:99.9%, high quality and low price, fast delivery, if you have any interesting, please click it to check the specification.

Brand:
SAT NANO
Item NO.:
MP50-25U
Payment:
TT, Paypal, WU
Product Origin:
China
Color:
grey
Shipping Port:
Shenzhen, Shanghai
Lead Time：
1-5days
Min Order:
1kg

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Product Details

Specification of Sn powder:

CAS No:7440-31-5

ENINEC No.:231-141-8
Appearance:grey powder

Shape:Spherical

Size: 25-63um, O <90ppm

25-45um, O<110ppm

20-38um, O<120ppm

15-25um, O<140ppm

Note: We can supply different size products of heat insulation coating sn nanopowders according to client's requirements.

The nano tin powder product is stable and has a uniform particle size.

Application of Sn powder:

Tin powder is a key material to ensure the quality of soldering and installation of electronic components and printed circuit boards or substrates and realize the functions of electronic products. It is widely used in surface mount (SMT), semiconductor packaging and other process fields.

Hot Tags : Sn powder Tin Micron Powder Sn powder for Semiconductor packaging Tin Oxide Nanopowder heat insulation coating sn nanopowders

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