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SnAgCu powder SnBiCu powder SnCu powder tin powder

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September 23,2026.

Holiday Notice — Mid-Autumn Festival & National Day

Dear Customers,  Thank you for your ongoing support and trust. Our office will be closed for two upcoming holidays:  · Mid-Autumn Festival — September 25 to 27, 2026  · National Day Holiday — October 1 to 7, 2026  Our mailbox does...

July 21,2026.

SAT NANO Ships 1KG Nano TiO₂ Dispersion to South Korean Client — Purpose-Built for Photocatalytic Applications

Last week, SAT NANO successfully completed an export order to the South Korean market — delivering 1KG of aqueous nano titanium dioxide (TiO₂) dispersion to a Korean company specializing in photocatalytic environmental remediation. The...

July 6,2026.

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June 4,2026.

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April 23,2026.

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SnAgCu powder SnBiCu powder SnCu powder tin powder

buy SnAgCu powder SnBiCu powder SnCu powder tin powder, Size:25-63um, 25-45um, 20-38um,15-25um, Purity:99.95%, high quality and low price, fast delivery, if you have any interesting, please click it to check the specification.


  • Brand:

    SAT NANO
  • Item NO.:

    MP50-25U
  • Payment:

    TT, Paypal, WU
  • Product Origin:

    China
  • Color:

    grey
  • Shipping Port:

    Shenzhen, Shanghai
  • Lead Time:

    1-5days
  • Min Order:

    1kg
  • Product Details

Specification of Sn powder:

We can supply SnAgCu powder Sn69.5 Bi30 Cu0.5 powder Sn99.3 Cu0.7 powder, Sn64.9 Bi35Ag1 powder, Sn42Bi58 powder


CAS No:7440-31-5

ENINEC No.:231-141-8
Appearance:grey powder

Shape:Spherical

Size: 25-63um, O <90ppm


25-45um, O<110ppm

20-38um, O<120ppm

15-25um, O<140ppm


Note: We can supply different size products of heat insulation coating sn nanopowders according to client's requirements.

The nano tin powder product is stable and has a uniform particle size.


Application of Sn powder:

Tin powder is a key material to ensure the quality of soldering and installation of electronic components and printed circuit boards or substrates and realize the functions of electronic products. It is widely used in surface mount (SMT), semiconductor packaging and other process fields.



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