The 14th Shenzhen International Thermal and Heat Dissipation Materials and Equipment Exhibition (CIME2025) will be held from June 4-6, 2025 at the Shenzhen International Convention and Exhibition Center. The exhibition area is 20000 square meters, with 500 exhibitors, 30 academic presentations, and 30000 professional visitors. The CIME International Thermal Insulation and Heat Dissipation Exhibition, founded in Shenzhen in 2013, has undergone more than ten years of development and resource accumulation, and has become a well-known and authoritative industry event in the field of thermal management thermal insulation and heat dissipation. It has now developed into the June Shenzhen Exhibition and the December Shanghai Exhibition, touring the two places and deeply discussing the changes and development of thermal management thermal insulation and heat dissipation with local governments, industry associations, industrial parks, partners, and industry elites, and has received warm responses. As an industry event, CIME Exhibition looks forward to everyone joining hands with CIME Exhibition to continue moving forward together, creating brilliance and providing customers with higher quality, more professional, and more comprehensive one-stop solutions.

With the advancement of consumer electronics, 5G, and artificial intelligence XR、 Against the backdrop of continuous technological penetration and upgrading in fields such as data centers, the Internet of Things, power batteries, energy storage, and Industry 4.0, the miniaturization and continuous increase in power density of electronic devices have led to rapid accumulation of heat energy, weakened safety, and shortened service life. With the continuous advancement of technology, the demand for thermal management, heat conduction, and heat dissipation is also constantly increasing, and the market size is growing exponentially. This has brought enormous potential and commercial cooperation space to the thermal management, heat conduction, and heat dissipation industry.

In order to further promote communication and interaction in the thermal conductivity and heat dissipation industry, strengthen the awareness of communication and cooperation in China's thermal conductivity and heat dissipation industry, and achieve mutual promotion and common development, the 14th Shenzhen International Thermal Conductivity and Heat Dissipation Materials Exhibition and Development Summit Forum, hosted by Bohan Exhibition&Liyue Exhibition, will be held from June 4th to 6th, 2025 at the Shenzhen International Convention and Exhibition Center (Bao'an New Hall). The conference aims to establish a communication platform for technical exchange and information exchange in the field of thermal conductive materials, promoting breakthroughs in technology and industrial development in the thermal conductive materials industry. The conference warmly welcomes experts, scholars, researchers, and business representatives from relevant fields at home and abroad to actively participate. At the same time, companies, enterprises, and institutions are welcome to showcase their technological achievements and negotiate cooperation between industry, academia, and research.

SAT NANO also participated in this exhibition, and the boron nitride powder, aluminum nitride powder, magnesium oxide powder, and aluminum oxide powder exhibited by SAT NANO are all used for thermal conductivity purposes. If you have any enquiry, please feel free to contact us at admin@satnano.com